ABOUT US
Process-Oriented Packaging Material Supply and Technical Support
Shenzhen Getai Technology Co., Ltd. specializes in supplying materials and technical support for semiconductor packaging and electronic assembly. Our product portfolio includes evaporation materials, sputtering targets, bonding wires, preforms, and SMT materials, serving industries such as semiconductor packaging, wafer testing, photovoltaics, flat panel displays, and precision electroplating. We organize our material catalog by process step to help procurement and engineering teams quickly map process requirements to specific grades and specifications.
COMPANY PROFILE
Serving the semiconductor and electronics manufacturing supply chain
Our product portfolio spans multiple material lines including evaporation materials, sputtering targets, bonding wires, preforms, and SMT materials, serving industries such as semiconductor packaging, wafer testing, new energy photovoltaics, flat panel displays, and precision electroplating.
We organize the material catalog by process steps. Procurement and process engineers should first define the process stages and key parameters, then match them to specific grades and specifications to reduce trial-and-error costs during new material onboarding.
The supply process retains incoming and outgoing inspection records along with sample retention. Key parameters such as purity, wire diameter, and alloy system are provided per batch to facilitate customer management of batch consistency and traceability.
Capabilities & Quality
Capabilities and Quality Control
Demonstrate supply capacity with verifiable parameters; provide batch-specific test data for key metrics.
- Purity of Evaporation Materials
- ≥99.999%High-purity silver and other evaporation materials are supplied according to purity specifications.
- Bonding wire diameter range
- φ10~80 μmOverlays for gold, silver, copper, and composite structures
- Preformed solder alloy
- 50+Supports flux coating and packaging in carrier tape, glass bottles, etc.
- Sputtering Target
- 10+ GradeCustomizable ingredients and dimensions to meet your specific requirements.
WHY GETAITECH
Four Supply Principles
Designed around real-world engineering and procurement scenarios—from component selection and traceability to minimum order quantities and response speed.
Select by Process
Organize the material catalog by key processes such as wafer fabrication, packaging and interconnection, and surface mount technology to reduce selection trial-and-error.
Batch Traceability
Incoming and outgoing materials undergo purity, wire diameter, and alloy system testing with retained samples; batch information is fully traceable.
Available for small-batch orders
Supports sample and low-volume orders to reduce validation costs during new material onboarding.
Daily Feedback
Provide process details for same-day feedback on available materials and specification recommendations.
SERVICE PROCESS
Collaboration Process
Import materials in four steps from submission to bulk supply.
- 01
Submit Process Information
Specify process steps, package type, and key parameter requirements.
- 02
Match Material Grade
Match available materials and specifications to the process, then provide comparison recommendations.
- 03
Sample Validation
Samples and small-batch supply available to support production line validation.
- 04
Batch & Traceability
Batch supply with retained batch testing and sample records.
INDUSTRIES SERVED
Service Industry
Materials span multiple stages, from wafer fabrication to electronic assembly.
Inquiry
Tell us your process, and we'll provide the bill of materials.
Submit process steps, packaging type, and key parameter requirements for same-day feedback on recommended materials and specifications, with sample validation support.