High-Purity Gold (Au1)
Purity ≥99.999%, available in flake and cylinder forms. Custom specifications supported.
Semiconductor Packaging Materials
Find the right packaging material by process step
Material selection catalog covering deposition materials, sputtering targets, bonding wires, preformed solder wafers, and SMT materials—from wafer fabrication to packaging and testing. Small-batch ordering available with full batch traceability; grades matched to specific process steps.
≥99.999%
Deposition Material Purity
10+
Sputtering Target Grade
50+
Pre-formed solder alloy
φ10μm
Smallest Bonding Wire Diameter
Select by Process
Organize the material catalog by key processes such as wafer fabrication, packaging and interconnection, and surface mount technology to reduce selection trial-and-error.
Batch Traceability
Incoming and outgoing materials undergo purity, wire diameter, and alloy system testing with retained samples; batch information is fully traceable.
Available for small-batch orders
Supports sample and low-volume orders to reduce validation costs during new material onboarding.
Daily Feedback
Provide process details for same-day feedback on available materials and specification recommendations.
BY PROCESS · Materials Line
Find materials by process step
From wafer fabrication to packaging and testing, organize materials by process step to help procurement and engineering teams quickly locate grades and specifications.
Published Material Catalog
Splashed Gold (Au01)
Purity ≥99.999%, with extremely low C, N, and O impurities; features low and stable contact resistance, easy film formation, excellent fusion capability, and strong adhesion to the semiconductor substrate.
High-Purity Silver (Ag01)
Purity ≥ 99.999%
Platinum (Pt1)
Purity ≥ 99.99%
High-Purity Aluminum (Al01)
Purity options: 4N / 5N / 5N5
High-purity Titanium (Ti01)
Purity options: 4N / 4N5 / 5N
INSIGHTS · News & Updates
Insights and Technical Knowledge
Company news, product launches, and selection guides—browse by category to find what matters most.
Published News
Pre-formed solder tabs now available in multiple custom shapes and packaging options
Adds custom shapes such as square and U-shaped to the standard rectangular, washer, and disc formats. Supports flux coating, tape-and-reel packaging, and glass bottle packaging.
High-purity silver production line completes new purity testing and batch sample retention.
Re-test the purity of high-purity silver Ag01 batches and retain samples. Test data will be provided with batch shipments to facilitate customer traceability for batch consistency.
Bonding wire diameter specifications cover the full range of φ10~80μm.
Bonding wire G2 / GK / GJ covers a diameter range of φ10~80μm. Select the appropriate specification based on package type and reliability grade.
INDUSTRY APPLICATIONS
Application Solutions by Industry
Demonstrate how our materials solve real-world problems in your manufacturing processes. We break down each solution by addressing pain points, recommending the optimal material, and detailing key performance parameters.
ABOUT GETAITECH
An encapsulation material supplier that speaks in parameters and processes
Shenzhen Getai Technology Co., Ltd. specializes in supplying materials and technical support for semiconductor packaging and electronic assembly. Our product portfolio includes evaporation materials, sputtering targets, bonding wires, preforms, and SMT materials, serving industries such as semiconductor packaging, wafer testing, photovoltaics, flat panel displays, and precision electroplating. We organize our material catalog by process step to help procurement and engineering teams quickly map process requirements to specific grades and specifications.
- Purity of Evaporation Materials
- ≥99.999%
- Bonding wire diameter range
- φ10~80 μm
- Preformed solder alloy
- 50+
- Sputtering Target
- 10+ Grade
INQUIRY
Provide process information and receive the material list feedback for the day.
Submit process steps, packaging format, and key parameter requirements. We will provide feedback on available materials and specifications the same day, supporting sample and small-batch validation.
- 81600812@qq.com
- Service Hours
- Monday to Friday 9:00-18:00