Gold-Germanium-Nickel Alloy (AuGeNi 11.5-2 / 12-4 / 11-4.5)
Eutectic solder alloy available in granular and flake forms; composition analyzed via ICP-AES, fire assay, and titration; complies with GB/T 11066.
参数：共晶焊料合金，提供颗粒与片状两种形态；成分经 ICP-AES、火试金、滴定法分析；执行 GB/T 11066 用途：半导体芯片焊接 适用工序：芯片贴装