Gold-tin alloy (AuSn20 / AuSn25)Solder paste, diameter 4±0.2 mm, melting point approximately 280℃; ingot structure is dense and uniform.参数：颗粒焊料，直径 4±0.2 mm，熔点约 280℃；铸锭组织致密均匀 用途：光电子器件、激光器气密封装等高可靠性焊接 适用工序：芯片贴装 / 封帽