Palladium-plated copper wire
Dense, uniform palladium-plated copper wire surface; high tensile strength, low arc radius, high modulus, and corrosion resistance.
参数：铜丝表面覆盖致密均匀镀钯层；高拉断力、低弧度、高模量、抗腐蚀 用途：集成电路与 LED 封装引线键合 适用工序：键合
Dense, uniform palladium-plated copper wire surface; high tensile strength, low arc radius, high modulus, and corrosion resistance.
参数：铜丝表面覆盖致密均匀镀钯层；高拉断力、低弧度、高模量、抗腐蚀 用途：集成电路与 LED 封装引线键合 适用工序：键合