Semiconductor Packaging
Semiconductor Packaging and Interconnect Bonding
From bonding wires and probe substrates to high-purity silver and sputtering targets, our materials span critical stages from wafer fabrication through packaging and testing.
01 · PAIN POINT
Process Pain Points
Packaging formats vary widely, and different reliability levels impose significantly distinct requirements on bond wire diameter, loop height, and mechanical properties. Improper selection can compromise bonding yield.
02 · SOLUTION
Material Proposal
Match wire bond type and diameter to packaging form and reliability grade, covering gold, silver, copper, and composite structures. Provide pre-formed solder pads and surface-mount materials for complete interconnect solutions.
03 · KEY METRICS
Key Parameters
- Bonding wire diameter
- φ10~80 μm
- Bonding wire purity
- 99.99%
- Pre-formed alloy
- 50+
DETAILS
App Description
Semiconductor packaging and wire bonding are the most material-intensive stages: from wire bonding and die attach to hermetic sealing, each process involves a distinct material system.
Wire bonding materials—gold, silver-based, copper-based, or hybrid—are selected based on package type and reliability requirements. Wire diameters of φ18~30μm are commonly used in general IC packaging; finer wires suit high-density interconnects, while thicker wires support high-current and high-reliability applications.
The chip attachment and hermetic packaging stages can utilize preforms to precisely control solder volume according to package dimensions. Combined with flux coating and tape-and-reel packaging, this setup facilitates easy line-side handling and reduces void formation.
Material suppliers provide purity and wire diameter test data with each batch, including retained samples, to enable packaging facilities to trace batch consistency.
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Inquiry
Need material solutions for semiconductor packaging processes?
Provide process steps and key parameter requirements. Submit a list of selectable materials with specification recommendations by the end of the day.