Wafer Test
Wafer Testing and Probe Manufacturing
Palladium-based multi-element alloy probes balance conductivity and mechanical strength, ensuring reliable materials for wafer testing and chip validation.
01 · PAIN POINT
Process Pain Points
Probes must maintain conductivity and mechanical strength through repeated contact; fluctuations in base material composition directly affect test stability and probe lifespan.
02 · SOLUTION
Material Proposal
Provide palladium-based multi-component alloy probe blanks, custom-tailored by composition and dimensions to meet material needs in wafer testing, chip verification, and precision interconnection.
03 · KEY METRICS
Key Parameters
- Base metal system
- Palladium-based multicomponent alloys
- Customization Options
- By Ingredient and Size
DETAILS
App Description
Wafer testing and probe manufacturing require a balance of electrical conductivity and mechanical strength in base materials. Getai Technology offers palladium-based multi-component alloy probes, with customizable composition and dimensions, ensuring reliable materials for wafer testing, chip verification, and precision interconnection applications.
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Inquiry
Need a material solution for the wafer testing process?
Provide process steps and key parameter requirements. Submit a list of selectable materials with specification recommendations by the end of the day.