High-Purity Gold (Au1)
Purity ≥99.999%, available in flake and cylinder forms. Custom specifications supported.
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Splashed Gold (Au01)
Purity ≥99.999%, with extremely low C, N, and O impurities; features low and stable contact resistance, easy film formation, excellent fusion capability, and strong adhesion to the semiconductor substrate.
High-Purity Silver (Ag01)
Purity ≥ 99.999%
Platinum (Pt1)
Purity ≥ 99.99%
High-Purity Aluminum (Al01)
Purity options: 4N / 5N / 5N5
High-purity Titanium (Ti01)
Purity options: 4N / 4N5 / 5N
High-purity Nickel (Ni01)
Purity options: 4N / 4N5
High-Purity Copper (Cu01)
Purity ≥ 99.999%
Gold-zinc alloy (AuZn5)
Zn 5±0.5%, Au balance; thickness (0.05–2)±0.1 mm, length (4–10)±0.2 mm; per GB/T 15072
Sputtering Target Series
High-purity gold target, gold target, Au-Ge-Ni alloy target, platinum target, nickel target, titanium target, copper target, tantalum target, Ni-Cr alloy target, W-Ti alloy target; composition and dimensions customizable