HallGeTai TechGetaitech

Home About Us Product Center Industry Solutions Industry News Contact Us

English

简体中文

Categorize Products

Product Categories

Evaporation and Sputtering MaterialsHigh-purity metals, alloys, and targets for vacuum evaporation and magnetron sputtering. Available in gold, silver, platinum, aluminum, titanium, nickel, copper, and more. Customizable composition and dimensions.

Bonding and Test MaterialsSelect wire bonding materials (gold, silver, copper, or gold-silver alloy wires) and probe card base materials for wafer testing based on packaging format and reliability grade.

Preformed solder wafersKINJI high-temperature solder sheets and lead-free low-temperature solder sheets are available in rectangular, round, ring, and frame shapes. Alloy systems and melting points can be selected based on the process requirements.

Alloy SolderEutectic solder alloys such as gold-tin, gold-germanium-nickel, and others are available in both granular and flake forms for high-reliability applications including chip bonding and hermetic packaging.

SMT and Tin-Based MaterialsSMT mounting and tin-based soldering materials, including red glue for component placement, solder paste, solder wire, BGA balls, solder ingots, and solder rods.

Gold-tin alloy (AuSn20 / AuSn25)

Solder paste, diameter 4±0.2 mm, melting point approximately 280℃; ingot structure is dense and uniform.

Gold-Germanium-Nickel alloy (AuGeNi 11.5-2 / 12-4 / 11-4.5)

Gold-Germanium-Nickel Alloy (AuGeNi 11.5-2 / 12-4 / 11-4.5)

Eutectic solder alloy available in granular and flake forms; composition analyzed via ICP-AES, fire assay, and titration; complies with GB/T 11066.

PavilionShenzhen Geti Technology Co., Ltd.

Semiconductor Packaging Materials · Select by Process StepA process-driven material selection catalog serving semiconductor packaging, wafer testing, photovoltaics, flat panel displays, and precision plating industries.

Quick Navigation

Home
Product Center
Industry News
Industry Applications
About Us
Contact Us

Material Line

Evaporation materials
Sputtering Targets
Bonding wire
Preformed solder wafers
SMT materials

Contact Us

ShenzhenUnit B13A, 5th Floor, Phase IV, HALO Plaza, No. 260 Taoyuan Road, Sunxi Community, Sungang Street, Luohu District, Shenzhen
Southwest CenterNo. 245, WenCui Road, Mengzi City, Honghe Hani and Yi Autonomous Prefecture, Yunnan Province
15019238275 15398691316
81600812@qq.com
Monday to Friday 9:00-18:00

Copyright ©2026 Shenzhen Getai Technology Co., Ltd.

Semiconductor Packaging Materials

Guangdong ICP Certificate No. 2024268262-1