Gold alloy wire (G2/GK/GJ)
Purity 99.99%, wire diameter φ10–80 μm
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Gold alloy bonding wire
H1 (Au 80±0.5%) and H3 (Au 60±0.5%) compositions
Silver alloy bonding wire (502/503/504/506)
Silver content: 99%–88%; wire diameter: φ18–30 μm
Gold-Silver Alloy Bonding Wire (AW2/AW4/AW7)
Ag 62%–95%, Au ~4%; resistivity 2.3–3.5 μΩ·cm
Bonded Copper Wire (C01/C02)
Copper content ≥99.99%, wire diameter φ18–30 μm, resistivity 1.70 μΩ·cm
Palladium-plated copper wire
Dense, uniform palladium-plated copper wire surface; high tensile strength, low arc radius, high modulus, and corrosion resistance.
Probe base material
Palladium-based multi-component alloy; excellent conductivity, low contact resistance, higher hardness than beryllium copper, good elasticity, and long rolling life; probe tips can be machined via electrical discharge or chemical etching.